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These circuits are temperature compensated and can be triggered from the slowest of input ramps and still give clean, jitter-free output signals. Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
On all other products, production processing does not necessarily include testing of all parameters. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Supply voltage, VCC see Note 1. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. Voltage values are with respect to network ground terminal.
MIN 1. Not more than one output should be shorted at a time. MAX 1. CL includes probe and jig capacitance. All diodes are 1N or equivalent. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples. Figure 2. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Samples may or may not be available. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free RoHS Exempt : This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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