IEEE 1101.2 PDF

Aragor Also similar to the embodiment of FIG. The configuration of FIG. Please select Ok if you would like to proceed with this request anyway. DIN EN remains valid alongside this standard until In the present invention, the wedgelock is mounted to one surface of the frame such that when installed in a conduction-cooled chassis, the opposite frame surface is forced against the chassis cold wall.

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Vujora Your request to send this item has been completed. In the convection-cooled configuration, air flow over the card is used to remove component heat. Legal notices Photo Preview this item Preview this item.

In particular, the adapter frame structure of the present invention is designed to allow the use of large ieer, e. In any event, an extended width wedgelock allows for greater surface contact area 30 to improve the thermal performance.

But the driving force has been a standard developed by the IEEE. Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus. However, formatting rules can vary widely ieee applications and fields of interest or study. As described above, the removal of the protrusion 4 allows for an increase in the width of the contact surface between the frame 1 and chassis 2 by ieee about 0.

Certification of persons Do recognize your skills, register online to become certified. The heat is then removed from the by external means. Document, Internet resource Document Type: This embodiment has a protrusion 14 and thus, is compliant with the IEEE Please choose whether or not you want other users to be able to see on your profile that this library is a favorite of yours.

Conduction cooling allows the circuit boards to be sealed in the systems enclosure without requiring airflow. It is contemplated that the use of the present invention can involve components having different characteristics as long as the principle is followed, i. Conduction cooled CompactPCI boards ready for insertion Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module.

Write a review Rate this item: The increased wedgelock size approximately doubles the clamping force applied with respect to conventional modules. However, none of these patents disclose or suggest a structure ueee satisfies the IEEE Thus, the surface contact area between the circuit card module is increased and the thermal performance improved without impacting the existing COTS design.

The E-mail message field is required. Linked Data More info about Linked Data. These two effects reduce the efficiency of movement of the heat to the cold wall of the chassis. The restructuring results in a frame 11 that optionally eliminates the protrusion 4 of FIG.

Device for increased thermal conductivity between a printed wiring assembly and a idee. Your list has reached the maximum number of items. Register online at inter and intra-company training, and certifying diplomas, seminars, distance learning. A full appreciation of the various aspects of the invention can only be gained by taking the entire specification, claims, drawings, and abstract as a whole. Search WorldCat Find items in libraries near you. The analysis showed that the conventional design, as illustrated in FIG.

Some features of WorldCat will not be available. A challenge posed by the IEEE In fact if a system is not custom, based on a nonstandard backplane architecture, and if a 6U form factor can be used, then typically VME has been used.

Although the wedgelock 3 would most likely be used in practice, a larger wedgelock can also be used in this alternate embodiment. The specific requirements or preferences of your reviewing publisher, classroom teacher, institution or organization should be applied.

Conduction-Cooled PMC CCPMC Commercially-available, off-the-shelf components that are included in circuit card modules are often unreliable when exposed to the high temperatures present in, for example, the military environment. The circuit card module of FIG. Industrial communication networks — Profiles — Part The increased , in combination with the additional contacting surface areas, ieer reduces the thermal resistance between the frame and the chassis 2 cold wall.

Option to visualize changes at a glance. Thermal conductance retainer for electronic printed circuit boards and the like. More information add to basket. Related Articles.

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IEEE 1101.2 PDF

Dokazahn IEEE — January A card guide 18 is attached to the convection-cooled chassis 12 with for example, screws, for receiving the card 7 by its protrusion 4. Get a quote for certification of systems, products or services, and get certified. There are several factors driving this interest in CompactPCI:. Other variations and modifications of the present invention will be apparent to those of skill in the art, and it is the intent of the appended claims that such variations and isee be covered. Once this specification was available conduction cooled boards from different manufacturers could be used in the same system with no mechanical fit issues. Thermal conductance retainer for electronic printed circuit boards and the like.

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IEEE 1101.2

Nilkree Please select Ok if you would like iefe proceed with this request anyway. Thus, with an approximately 40 Watt W module, for example, there is an average 8. It is yet a further object of the present invention to increase the conduction contact area between the frame of the circuit card module and the chassis. Further, the frame 11 eliminates the need for the metal strip 5 of FIG.

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